Semiconductor device fabrication
Photolithography is a standard process step in semiconductor device fabrication. Heidelberg Instruments Maskless Lithography tools cover a wide range of lithography applications in the Front-End-Of-Line as well as in the Back-End-Of-Line semiconductor production. Direct patterning of wafers can be performed by all systems from the product lineup. The tools offer advanced alignment capabilities to build up multi-layer devices. The µPG series are used for rapid prototyping of all kinds of new electronic components for example rolled-up electronic devices. Applications, which require smaller features, higher speed and better exposure performance can be created utilizing the DWL and VPG+ series of direct write lithography systems.
The production of high-end photomasks for steppers and mask aligners is one of the preferred applications for VPG+ and DWL systems. They fulfill all demands for advanced photomask fabrication and represent the standard photomask production solution in the market.
Most recently, Heidelberg Instruments has added the ULTRA Semiconductor Mask Writer to its portfolio. The ULTRA has been designed and optimized specifically for the production of semiconductor photomasks in the 150 nm design node. It is characterized by speed, an advanced data path, high precision and structure uniformity, and extremely accurate alignment features, while representing an economical solution with low cost of ownership.