President and CEO
Martin Wynaendts is the CEO and President of Heidelberg Instruments.Since January 2005 he was the CFO and President. In 1999 he became the CEO of the subsidiary Heidelberg Instruments System-Entwicklungs-GmbH a company specializing in customized electronic production solutions, which was merged with Heidelberg Instruments in 2006. Prior to that, he worked as a product manager for hotel software solutions worldwide and was a regional sales manager in Eastern Germany for a large hotel chain. In this chain he started as management trainee before becoming a manager in several departments and hotels in Germany. Mr. Wynaendts holds a degree in Business and Finance.
Mr Steffen Diez received his Diploma of Electrical Engineering from the Karlsruhe University in 1999. In 2000 he joined the Data Conversion Software group of Heidelberg Instruments and became its leader in 2003. From 2005-2010 he worked as an R&D Manager for PCB Exposure Systems where new SLM based Light Engines were the first time introduced in Heidelberg’s products. During a one year stay in Japan, he was responsible for Technical Sales and Business Development in Asia. After returning to Germany he worked on DMD based Direct Write Lithography systems. In 2012 he successfully introduced the µPG501 into the market. Since 2012 he leads the Customer Application Center in Heidelberg and uses his experience in the different fields to support the worldwide sales and expand HIMT’s Business Development activities. He has been a member of the Technical Board since 2012.
Mr. Konrad Roessler has been in charge of the Global Customer Support and Customer Application Center at Heidelberg Instruments since 2005. He graduated from Heidelberg University with a Diploma in Physics in 1993. After a short period at Leica Lasertechnik, he joined Heidelberg Instruments in 1994. There, he worked partly for R&D and customer applications, experienced the development and success of the first MW 800 lithography systems, especially in Asia. He was a key contributor in start up and management of Customer Support offices in Taiwan (1997-1999), China (1999) and Japan (2002-2004). During this period he learned the requirements and needs of Heidelberg Instruments equipment in production companies.
Vice President, Global Sales and Business Development
Mr. Alexander Forozan has been the Vice President of Global Sales and Business Development since 2005. He is responsible for Heidelberg Instruments’ global revenue generation, as well as overseeing the day to day operations of the company’s international sales and marketing force. He joined Heidelberg Instruments in February 2001, serving as Manager of Marketing and Technical Sales in North America, and later Director of North and South American Sales. In this capacity, he grew the American market segment from a limited presence into a multi-million dollar enterprise instantly recognizable at many of the finest research institutions.
He began his career at Intel Corporation where he worked in Rio Rancho Fabrication site as a process engineer before joining the Assembly Technology Development in Chandler, Arizona, contributing to the chipset packaging for Mobil Computers. After Intel, he joined Mattel Corporation in El Segundo, California, where he was a lead Corporate Product Engineer working on interactive and high tech toy products (a joint venture between Intel and Mattel corporations). At Mattel Corp. he was active in several international projects ranging from management and coordination of United States operations with those of production in China to qualification of licensing in Latin America. Mr. Forozan holds a B.S. and M.S. in Engineering. He also holds executive business management from the University of California at Berkeley, Haas School of Business. He is an American Citizen.
Member of the Technical Board
Mr. Roland Kaplan received his Diploma in Physics from Heidelberg University in 1984. During his studies, he developed software to analyze emissions of nuclear power plants through a project financed by the German Government. Later, at the European Molecular Biology Laboratory (EMBL) in Heidelberg, he took part in the software-supported analysis of fluorescent spectrums. For his Diploma thesis - also at the EMBL - he worked on the upgrade of a Confocal Laser Microscope to a 3D raster scanning microscope.
After his studies in 1985, he joined Heidelberg Instruments as a software developer for real time image processing applications and by 1990 he was in charge of the Software Department.
With the installation of the first direct write laser lithography systems for wafer fabrication in 1992, he took over various functions in the application group. Later, he was a key player in development of the first UV based large area exposure system, introduced in 1997.
Since 2002 he has been leading the Research and Development group at Heidelberg Instruments, responsible for various innovations and technology implementations.
Mr. Kaplan has co authored a number of patents in the field of maskless lithography.
Dr. Peter Heyl
Member of the Technical Board
Dr. Peter Heyl received his Diploma in Physics from Heidelberg University in 1996. In that year he joined Heidelberg Instruments as a PHD student and worked for a BMBF project where he built up a system for laser ablation of hard metals for embossing tools which was adapted into the product portfolio of Heidelberg Instruments (LAM). In 1999 he joined our laser drilling (micro via) department and became the product manager of this product in the year 2001. In 2003 he became the project manager of our DWL2400 system witch was installed in the year 2004. After the installation and successful acceptance of the system, he was promoted to the Manager of the Application Department. Before he became the Product Manager of our Products uPG101, DWL66FS and DWL2000/4000 in 2011, he also took over the position of a Technical Business Development Manager. Since 2012 he is a member of our technical board.
Member of the Technical Board
Achim Jehle received his Diploma in Physics from Heidelberg University in 1994. During his studies he worked on a new type of Real Time Confocal Microscope at Leica Lasertechnik. When he joined Heidelberg Instruments in 1994 he started at the Mask and Application Center. In 1998 after a few years as application engineer he became Product Manager for DWL200/400 and Mask Write (MW) systems. Later he also became head of the Service and Application Department for two years before his focus went more into R&D. Over the years he was involved in several major R&D projects such as the MW1100 TFT, FastBeam Module, VPG and the 2nd Free Form Generation. In 2011 he became Product Manger of the VPG and all other Large Area Systems. Since 2012 he is a member of our technical board.