Key Features and Options

  • Substrates up to 200 x 200 mm2
  • Structures down to 0.6 µm
  • Address grid down to 50 nm
  • Multiple write modes
  • Vector and Raster exposure mode
  • 3D exposure mode
  • Camera system for alignment
  • Back to front side alignment
  • Climate chamber
  • Customer specific laser source
  • Optical and air-gauge auto focus
  • Scripting capability
  • Multiple data input formats (DXF, CIF, GDSII, Gerber, BMP, Ascii, STL)

Download Fact Sheet DWL 66 FS
[pdf / 1.3 MB]

DWL 66FS- The Ultimate R&D Laser Lithography Tool

DWL 66FS

Pattern

Pattern

Pattern

The ultimate lithographic research tool

The DWL 66FS laser lithography system is an economical, high resolution pattern generator for low volume mask making and direct writing.

The capabilities and flexibility of this system make it the ultimate lithographic research tool in MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, CGHs, and all other applications that require microstructures.

The customer base of the DWL 66FS includes over 100 leading universities and research facilities world wide. Many of the system features have been developed in close cooperation with these institutions.

The system can utilize a variety of different lasers, which makes it possible to expose nearly all photoresists, including UV resists like SU8. In addition to high resolution 2D patterns, it is also possible to create complex 3D structures in thick photoresist with a single pass. By supporting five different write modes the resolution and throughput of the system can be optimized for each application. The optional vector exposure mode will offer even further flexibility such as improved structure quality and a higher throughput for certain designs like waveguides or microfluidic channels.

For additional information please Download the Fact Sheet or Contact us anytime.