Key Features and Options

  • Substrates up to 200 x 200 mm2
  • Structures down to 0.6 µm
  • Address grid down to 10 nm
  • Multiple write modes
  • Advanced 3D exposure mode
  • Camera system for alignment
  • Back to front side alignment
  • Climate chamber
  • Customer specific laser source
  • Optical and air-gauge auto focus
  • Scripting capability
  • Multiple data input formats (DXF, CIF, GDSII, Gerber, BMP, Ascii, STL)
  • Online data transfer
  • Stage map correction
  • Automatic loading system

Download Fact Sheet DWL 2000
[pdf / 1.4 MB]

DWL 2000 - The Fast and Flexible Laser Lithography System

DWL 2000

Pattern

Pattern

Pattern

A high resolution pattern generator for mask making and direct writing

The DWL 2000 laser lithography system is a fast and flexible, high resolution pattern generator for mask making and direct writing. In addition to 2D patterns, the state of the art technology of the system can also create complex 3D structures in thick photoresist with a single pass.

With a write area of up to 200 x 200 mm2 the system is the perfect solution for fast patterning of masks and wafers in MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, CGHs, and all other applications that require microstructures.

For additional information please Download the Fact Sheet or Contact us anytime.